HMA Glue Hot Melt Adhesive Piezo Jet Valve for Smartphone/PAD Frame Bonding application
Piezoelectric jetting valves are increasingly used in hot melt adhesive dispensing for smartphone/pad middle frame and bezel assembly. These high-precision, non-contact jetting valves provide excellent control over glue volume and placement. For hot melt applications, maintaining stable glue temperature is critical to ensure smooth flow and avoid nozzle clogging or stringing.
Mingseal’s hot melt piezo valve system KPS2000-R is specially designed for this process. It includes a dedicated heated glue tank and special seals that maintains adhesive viscosity within optimal range throughout the operation. This enables extended open time, avoiding premature curing and minimizing downtime due to nozzle maintenance.
The solution is ideal for edge sealing, frame bonding, and multi-point glue dispensing on smartphones and tablets, where space is limited and aesthetics are critical. Jetting performance remains stable across high-speed production lines, supporting cycle times as low as milliseconds per dot.
Core Advantages
- Non-contact spraying
- High-temperature spraying capability
- High-speed precision dispensing
- Fine glue dot control
- Cost effective and high performance
Main appliaction
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Mobile phone middle frame glue dispensing: hot melt glue is applied to the inner edge of the middle frame for bonding glass cover, OLED module or metal backplane.
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PAD middle frame glue dispensing: larger size, longer glue dispensing path, requiring uniform glue spraying and fast speed.
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Multi-point positioning/rib bonding: bonding of local structural parts, such as internal bracket, FPC fixing position, and nut position glue dispensing.
Technical parameters
| KPS2000-R adhesive dispensing valves |
| Minimum glue spraying amount |
0.5nl(CPK＞1.33) |
| Viscosity of glue |
Medium or high viscosity up to 500,000mpas |
| Max jetting frequency |
1200Hz |
| Work temperature range |
10～50°C |
| Corrosion resistance |
All aqueous media, organic solvents, weak acids and weak bases |
| Size |
125.5×40×20mm(No runner assembly included)125.5×75×20mm(Includes runner assembly) |
| Weight |
430g(With fluid box, no cables) |
| KPC2000 controller |
| AC power input |
AC 220V±20% |
| |
0.01ms~6000.00ms,0.01ms |
| Jetting frequency |
1~1200HZ |
| Settings display |
TFT color screen |
| |
10 set |
| Reserved interface |
Supports RS232/RS485 |
| Weight |
3.55KG |
| Size |
232×170×165 mm |
| Power |
275W |
FAQ
Q1: Can a piezo jet valve handle high-viscosity hot melt adhesives for smartphone frame bonding?
A1: Yes. Piezo jet valves are capable of dispensing high-viscosity hot melt adhesives with excellent consistency. Models like Mingseal’s hot melt series include heating modules to maintain stable fluidity, ensuring reliable jetting even for viscous materials used in smartphone middle frame bonding.
Q2: How does the valve prevent glue overflow or stringing on narrow bezel structures?
A2: The non-contact dispensing design and precise jetting control of the piezo valve allow accurate glue placement, even in frames with high aspect ratios (>55%). Optimized parameters and anti-stringing nozzle designs help avoid overflow and residue on narrow edges.
Q3: How do you ship the goods?
Usually for sample order, we ship by DHL, FedEx, TNT, SF.
For mass order, airline, sea shipping are also optional.
About Mingseal
Founded in 2008, Changzhou Mingseal Robot Technology Co., Ltd. is a technology-driven manufacturer of high-end equipment, specializing in connection, assembly, inspection systems, and key components for advanced semiconductor packaging and precision electronics. Our solutions are widely adopted by leading customers in sectors such as semiconductor packaging, consumer electronics, and automotive electronics. With a strong presence across Asia and the Americas, we deliver reliable support and innovation globally.
Partner with Mingseal to power the future of automatic manufacturing!
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